Presentations
Omiya, Masaki
41-52 items (total 52)
Edge Effects on Transmission Loss of Optical Fiber in Lateral-Pressure Test
- Speaker
- Youhei Ookubo, Kikuo Kishimoto, Hirotsugu Inoue, Masaki Omiya
- Conference Title
- [Conference Category International presentation] Conference Title 52nd IWCS/Focus, International Wire & Cable Symposium（Venue Philadelphia, Pennsylvania, USA） Dates 2003.11 - 2003.11
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Measurement of Interfacial Strength by Multi-Stages Peel Test
- Speaker
- M.Omiya, K.Kshimoto, H.Inoue, W.Yang, M.Amagai
- Conference Title
- [Conference Category International presentation] Conference Title 9th International conference on the Mechanical Behavior of Materials（Venue Geneva, Switzerland） Dates 2003.05 - 2003.05
- Presentation Format
- International presentation
- Conference Category
- Oral presentation (general)
Measurement of Copper Thin Film Adhesion by Multi-stages Peel Test
- Speaker
- M.Omiya, K.Kishimoto, H.Inoue and M.Amagai,
- Conference Title
- [Conference Category International presentation] Conference Title 4th International Symposium on Electronic Materials and Packaging(EMAP2002)（Venue Kaohsiung, Taiwan） Organizer IEEE CPMT Dates 2002.12 - 2002.12
- Organizer
- IEEE CPMT
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Mixed Mode Crack Extension Behavior of A2024-T351 Aluminum
- Speaker
- Husaini, K.Kishimoto, M.Hanji, M.Omiya, T.Shibuya
- Conference Title
- [Conference Category International presentation] Conference Title ETM2002, Experimental & Theoretical Mechanics（Venue Sanur, Bali, Indonesia） Dates 2002.03 - 2002.03
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Cohesive Zone Approach to the Mixed Mode Fracture Criterion of the Bonding Interface
- Speaker
- M.Omiya, K.Kishimoto
- Conference Title
- [Conference Category International presentation] Conference Title ETM2002, Experimental & Theoretical Mechanics（Venue Sanur, Bali, Indonesia） Dates 2002.03 - 2002.03
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Effect of Thermal Aging on Interfacial Strength of Solder Joints
- Speaker
- M.Omiya, K.Kishimoto and M.Amagi
- Conference Title
- [Conference Category International presentation] Conference Title The First Taiwan-Japan Workshop on Mechanical and Aerospace Engineering（Venue Tainan, Taiwan, R.O.C.） Dates 2001.12 - 2001.12
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
A Mechanical Reliability Assessment of Solder Joints
- Speaker
- K.Kishimoto, M.Omiya and M.Amagai,
- Conference Title
- [Conference Category International presentation] Conference Title 3rd International Symposium on Electronic Materials and Packaging(EMAP2001)（Venue Jeju Island, Korea） Organizer IEEE CPMT Dates 2001.11 - 2001.11
- Organizer
- IEEE CPMT
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Stress Singularities of Multi-Bonded Anisotropic Wedges
- Speaker
- C.Hwu, M.Omiya, K.Kishimoto
- Conference Title
- [Conference Category International presentation] Conference Title APCFS&ATEM'01（Venue Sendai, Japan） Organizer JSME Dates 2001.10 - 2001.10
- Organizer
- JSME
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Effect of Intermetallic Compound Layer Development on Interfacial Strength of Solder Joints
- Speaker
- M.Omiya, K.Kishimoto, T.Shibuya, M.Amagai
- Conference Title
- [Conference Category International presentation] Conference Title The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition(IPACK'01)（Venue Kauai, Hawaii, USA） Dates 2001.07 - 2001.07
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
The Influence of Plastic Deformation on Interface Fracture Behavior
- Speaker
- M.Omiya, K.Kishimoto, T.Shibuya
- Conference Title
- [Conference Category International presentation] Conference Title Meso-Mechanical Aspects of Material Behavior -- Symposium to Honor Professor Aoki's 60th Birthday（Venue Beppu, Oita, Japan） Dates 2000.10 - 2000.10
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Effect of Intermetallic Compound Layer Development on Mechanical Strength of 63Sn-37Pb Solder Joints
- Speaker
- K.Kishimoto, K.Masuda, M.Omiya, T.Shibuya, M.Amagai
- Conference Title
- [Conference Category International presentation] Conference Title 3rd International Conference and Poster Exhibition Micro Materials(MICROMAT2000)（Venue Berlin, Germany） Dates 2000.04 - 2000.04
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Finite Element Analysis of Interface Crack in Bimaterial Media using Cohesive Force Model
- Speaker
- Masaki OMIYA, Kikuo KISHIMOTO, Toshikazu SHIBUYA
- Conference Title
- [Conference Category International presentation] Conference Title Asian Pacific Conference for Fracture and Strength'99（Venue Pohang, Korea） Dates 1999.08 - 1999.08
- Presentation Format
- International presentation
- Conference Category
- Oral presentation (general)