Presentations
Omiya, Masaki
21-40 items (total 52)
Nano-structured for low-k insulating layer
- Speaker
- FUJII Toshiki, OMIYA Masaki
- Conference Title
- [Conference Category International presentation] Conference Title International Conference on Advanced Technology in Experimental Mechancis 2011（Venue Kobe, Japan） Dates 2011.09.19 - 2011.09.19
- Organizer
- 日本機械学会
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects
- Speaker
- Shoji Kamiya, Hisashi Sato, Masahiro Nishida, Chuantong Chen, Masaki Omiya, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Tadahiro Nagasawa
- Conference Title
- [Conference Category International presentation] Conference Title 11th international workshop on stress-induced phenomena in metallization（Venue Dresden, Germany） Dates 2010.04.12 - 2010.04.12
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Poster presentation
Evaluation of sub-micron scale local strength in the LSI interconnect structures
- Speaker
- Shoji Kamiya, Hisashi Sato, Masahiro Nishida, Chuantong Chen, Masaki Omiya, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Tadahiro Nagasawa,
- Conference Title
- [Conference Category International presentation] Conference Title 2010 materials research society spring meeting（Venue San Francisco, USA） Dates 2010.04.05 - 2010.04.05
- Invitation Status
- With
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Poster presentation
Modeling of low-k dielectrics in Advanced Nanoelectronics Interconnect Systems
- Speaker
- OMIYA Masaki, MIYAGAWA Shunsuke, FUJII Toshiki
- Conference Title
- [Conference Category International presentation] Conference Title 2nd International Workshops on Advances in Computational Mechanics（Venue Yokohama, Kanagawa, Japan） Dates 2010.03.31 - 2010.03.31
- Invitation Status
- With
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (invited, special)
Fabrication of Ionic Polymer Metal Composite Actuator with palladium electrodes and Evaluation of its Bending Response
- Speaker
- T. Kobayashi, T. Kuribayashi, M. Omiya
- Conference Title
- [Conference Category International presentation] Conference Title 2009 Material Research Society Spring Meeting（Venue Sanfransisco, USA） Organizer Materials Research Society Dates 2009.04 - 2009.04
- Organizer
- Materials Research Society
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Poster presentation
Numerical Simulation of Interfacial Failure between Copper and Porous Low-k Dielectrics
- Speaker
- Shunsuke Miyagawa, OMIYA Masaki
- Conference Title
- [Conference Category International presentation] Conference Title 17th European Conference on Fracture（Venue Brno, Czech Republic） Organizer European Structural Integrity Society Dates 2008.09.03 - 2008.09.03
- Organizer
- European Structural Integrity Society
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Poster presentation
Fracture of Conductive Ceramic Thin Film on Polymer Substrate in Opto-electric Devices
- Speaker
- OMIYA Masaki
- Conference Title
- [Conference Category International presentation] Conference Title 17th European Conference on Fracture（Venue Brno, Czech Republic） Organizer European Structural Integrity Society Dates 2008.09.02 - 2008.09.02
- Organizer
- European Structural Integrity Society
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
UV-ray irradiation effects on channeling crack formation of ceramic thin film on polymer substrate
- Speaker
- OMIYA Masaki
- Conference Title
- [Conference Category International presentation] Conference Title MicroNanoReliability 2007（Venue Berlin, Germany） Organizer Fraunhofer Micro Materials Center Berlin (MMCB),European Center for Micro- and Nanoreliability (EUCEMAN) e.V. Dates 2007.09.04 - 2007.09.04
- Organizer
- Fraunhofer Micro Materials Center Berlin (MMCB),European Center for Micro- and Nanoreliability (EUCEMAN) e.V.
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Delamination behavior of hard film on soft substrate during nano- and micro-indentation
- Speaker
- Kozuki, K., Omiya, M., Kishimoto, K.
- Conference Title
- [Conference Category International presentation] Conference Title MicroNanoReliability 2007（Venue Berlin, Germany） Organizer Fraunhofer Micro Materials Center Berlin (MMCB), European Center for Micro- and Nanoreliability (EUCEMAN) e.V. Dates 2007.09.03 - 2007.09.03
- Organizer
- Fraunhofer Micro Materials Center Berlin (MMCB), European Center for Micro- and Nanoreliability (EUCEMAN) e.V.
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
A Trial for Micro-Scale Evaluation of Adhesion Strength around Cu Metallization Systems
- Speaker
- Shoji Kamiya, Hitoshi Arakawa, Hiroshi Shimomura, Masaki Omiya
- Conference Title
- [Conference Category International presentation] Conference Title Material Research Society Spring Meeting（Venue SanFrancisco） Organizer Material Research Society Dates 2007.04 - 2007.04
- Organizer
- Material Research Society
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Study of delamination of thin film coating on cyclic nano-indentation test
- Speaker
- Kentaro Kozuki, Masaki Omiya, Kikuo Kishimoto and Hirotsugu Inoue
- Conference Title
- [Conference Category International presentation] Conference Title 2006 Asian Pacific Conference for Fracture and Strength (APCFS'06)（Venue Sanya, Hainan Island, China） Dates 2006.11.24 - 2006.11.24
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Poster presentation
Compressive Deformation in Aluminum Foam Investigated Using a 2D Object Oriented Finite Element Modeling Approach
- Speaker
- M.F. Adziman, S.Deshpande, M.Omiya, H.Inoue, K.Kishimoto
- Conference Title
- [Conference Category International presentation] Conference Title 2006 Asian Pacific Conference for Fracture and Strength (APCFS'06)（Venue Sanya, Hainan Island, China） Dates 2006.11.24 - 2006.11.24
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Crack Formation of Ceramic Thin Film on Polymer Substrate
- Speaker
- M.Omiya, K.Kishimoto
- Conference Title
- [Conference Category International presentation] Conference Title 2006 Asian Pacific Conference for Fracture and Strength (APCFS'06)（Venue Sanya, Hainan Island, China） Dates 2006.11.24 - 2006.11.24
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Poster presentation
Interfacial Strength of Ceramic Thin Film on Polymer Substrate
- Speaker
- M.Omiya, K.Kishimoto
- Conference Title
- [Conference Category International presentation] Conference Title 16th European Conference of Fracture（Venue Alexandroupolis, Greece） Dates 2006.07 - 2006.07
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Numerical Simulation of Indentation on Layered Structures
- Speaker
- M.Omiya, K.Kishimoto
- Conference Title
- [Conference Category International presentation] Conference Title WCCM VII, 7th World Congress on Computational Mechanics（Venue Los Angeles, California, USA） Dates 2006.07.18 - 2006.07.18
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Fatigue Crack Growth in Lead-free Solder Joints
- Speaker
- Masaki Omiya, Kikuo Kishimoto, Masazumi Amagai
- Conference Title
- [Conference Category International presentation] Conference Title 2005 International symposium on electronics Materials and Packaging(EMAP2005)（Venue Tokyo, Japan） Organizer IEEE CPMT Dates 2005.12 - 2005.12
- Organizer
- IEEE CPMT
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Evaluation of Fatigue Strength for Solder Joints after Thermal Aging
- Speaker
- Takeshi Miyazaki, Masaki Omiya, Hirotsugu Inoue, Kikuo Kishimoto, Masazumi Amagai
- Conference Title
- [Conference Category International presentation] Conference Title 2005 International symposium on electronics Materials and Packaging(EMAP2005)（Venue Tokyo, Japan） Organizer IEEE CPMT Dates 2005.12 - 2005.12
- Organizer
- IEEE CPMT
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Evaluation of Interfacial Strength of Layered Structure by Indentation Method
- Speaker
- Kikuo Kishimoto, Masaki Omiya, Takashi Nakano
- Conference Title
- [Conference Category International presentation] Conference Title 2005 ASME International Mechanical Engineering, Congress & Exposition（Venue Orlando, Florida, USA） Organizer ASME Dates 2005.11 - 2005.11
- Organizer
- ASME
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)
Interfacial Strength Evaluation by Finite Element Method with Cohesive Zone Model
- Speaker
- Kikuo Kishimoto, Hirotugu Inoue, Masaki Omiya
- Conference Title
- [Conference Category International presentation] Conference Title WCCM VI in conjunction with APCOM'04（Venue Beijing, China） Dates 2004.09 - 2004.09
- Presentation Format
- International presentation
- Conference Category
- Oral presentation (general)
A Cohesive Zone Model and Interfacial Crack Problems
- Speaker
- K.Kishimoto, M.Omiya
- Conference Title
- [Conference Category International presentation] Conference Title IUTAM Symposium on Mesoscopic Dynamics of Fracture Process and Materials Strength（Venue Tsinghua University, China） Organizer IUTAM Dates 2004.09 - 2004.09
- Organizer
- IUTAM
- Presentation Format
- International presentation
- Language of Publication
- English
- Conference Category
- Oral presentation (general)