Industrial property rights
Omiya, Masaki
1-6 items (total 6)
半導体集積回路の配線構造設計装置
- Application date
- 2014-211318 2014.10
- Rights type
- Patent
- Ownership type
- Joint
- Inventor
- 大宮正毅、神谷庄司
- Applicant
- 国立大学法人名古屋工業大学
- Application status
- Application
構造物荷重伝達計算装置
- Application date
- 2013-131205 2013.06
- Rights type
- Patent
- Ownership type
- Joint
- Inventor
- 大宮正毅、高橋邦弘、市川博也、槇徹雄、櫻井俊彰
- Release date
- 2015-5230 2015.01
- Applicant
- 学校法人慶應義塾
- Application status
- Publication of unexamined application
表層密着強度測定方法および装置
- Application date
- 2009-223824 2009.09
- Rights type
- Patent
- Ownership type
- Joint
- Inventor
- 大宮正毅，西山逸雄
- Release date
- 2011-75286 2011.04
誘電経路の数値解析装置
- Application date
- 2009-191632 2009.08
- Rights type
- Patent
- Ownership type
- Joint
- Inventor
- 大宮正毅，高橋邦弘，宮川隼輔
- Release date
- 2011-43982 2011.03
- Applicant
- 学校法人慶應義塾
- Application status
- Publication of unexamined application
荷重推定方法
- Application date
- 2008-227390 2008.09
- Rights type
- Patent
- Ownership type
- Joint
- Inventor
- 森茂，三原美鶴，岸本喜久雄，井上裕嗣，天谷賢治，大宮正毅
- Release date
- 2010-60462 2010.03
最適化計算装置、最適化計算方法及びプログラム
- Application date
- 2018-017652 2018.02
- Rights type
- Patent
- Ownership type
- Joint
- Inventor
- 大宮正毅，高橋邦弘，宮下朋之，藤田知樹
- Applicant
- 学校法人慶應義塾
- Application status
- Application